a passion for challenges, a drive for solutions
If the tool doesn’t exist to assemble
the job efficiently, we will build one
Clean Room
Adhesive Bonding:
• Solvent
• UV Cured
Ultrasonic
RF Welding
Heat Staking
Packaging
Electromechanical
Soldering
Secondary finishing:
• Drilling
•
Thread tapping
Automation
Electronic
• PGA Sockets
• Configurable 4 cavity mold
• Over 150 configurable arrays
sizes and patterns
• 0.100” standard pin pitch
• Flatness 0.003”
iSO
13485: 2016